Abstract: An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered ...

Abstract: This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be ...

Abstract: Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150–250W per chip for high performance applications. One of the primary obstacles to the ...