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RISRelationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead Free Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the formation and the growth of the intermetallic compound (IMC) layer at the interface between the Sn3.0Ag0.5Cu Pbfree solder and the Cu substrate during isothermal aging at 150 آ°C. We measure ...
Analytical Solutions and a Numerical Approach for Diffusion Induced Stresses in Intermetallic Compound Layers of Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Intermetallic compounds (IMC) play a key role in the mechanical reliability of solder joints. The present work investigates the diffusioninduced stress developed in the Cu pad/IMC/solder sandwich structure during a solidstate ...
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, ...