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RISSolving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electronics industry is heading toward the threedimensional (3D) microprocessor to cope with higher computing workloads. The 3D stacking of the processor and the memory components reduces the communication delay in ...