Abstract: Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach ...

Abstract: This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder ...

Abstract: Laser soldering is becoming more popular for soldering pin through-hole (PTH) components onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability. However, it is difficult to accurately ...