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    Moiré Interferometry Analysis of Laser Weld Induced Thermal Strain 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003:;page 177
    Author(s): V. T. Kowalski; A. S. Voloshin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental method is presented to study laser weld induced thermal strain using digital image analysis enhanced moiré interferometry. A phenomenon that occurs in the assembly of optical ...
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    Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moiré Interferometry 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004:;page 303
    Author(s): A. F. Bastawros; A. S. Voloshin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fractional Fringe Moiré Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced ...
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    In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003:;page 314
    Author(s): A. S. Voloshin; R. A. Pearson; P.-H. Tsao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Development of the residual stresses in an organic adhesive, alumina filled epoxy (EPO-TEK H65-175MP) during curing process has been studied in-situ. The effect of the adhesive’s thickness was ...
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    Measurement of the Impulsive Bone Motion by Skin-Mounted Accelerometers 

    Source: Journal of Biomechanical Engineering:;1993:;volume( 115 ):;issue: 001:;page 47
    Author(s): W. Kim; A. Simkin; A. S. Voloshin; S. H. Johnson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A measurement system was designed to investigate longitudinal wave propagation through the lower extremity generated from foot strikes. The principal goal of the design was to eliminate measurement ...
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