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RISViscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SiLK is a polymer material developed for use as a thin-film dielectric in the interconnect structure of high-density integrated circuits. Among others, its thermomechanical properties play a ...