YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-3 of 3

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Random Response of Thick Laminated Rectangular Plates 

    Source: Journal of Vibration and Acoustics:;1991:;volume( 113 ):;issue: 003:;page 286
    Author(s): R. S. Srinivasan; P. A. Krishnan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The present paper deals with the random response analysis of clamped thick laminated rectangular plates subjected to white noise excitation. The refined plate theory postulated by Reddy has been ...
    Request PDF

    Rheological Investigations on Warm Mix Asphalt Binders at High and Intermediate Temperature Ranges 

    Source: Journal of Materials in Civil Engineering:;2018:;Volume ( 030 ):;issue: 004
    Author(s): Roja K. Lakshmi;Padmarekha A.;Krishnan J. Murali
    Publisher: American Society of Civil Engineers
    Abstract: Warm mix asphalt (WMA) technology is used to reduce mixing and compaction temperature of the binder; however, such addition is also expected to influence the rheological response of the binder during pavement service. This ...
    Request PDF

    Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components 

    Source: Journal of Pressure Vessel Technology:;2001:;volume( 123 ):;issue: 004:;page 501
    Author(s): H.-Q. Yang; L. Nguyen; S. Bayyuk; S. Mazumder; S. Lowry; A. Krishnan; A. Przekwas
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A computational technique is developed for accurate prediction of wire sweep during encapsulation of electronic components by transfer molding. The technique advances the current state-of-the-art ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian