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RISThe Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The self-alignment mechanism of molten flip-chip solder joints is being increasingly used in passive alignment of optoelectronic devices. For these applications, three-dimensional models of misaligned ...
LGA Connectors: An Automated Design Technique for a Shrinking Design Space
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ever-increasing demand for higher-density interconnection between a multi-chip module and the printed circuit board has resulted in the emergence of Land-Grid Array (LGA) connectors as an ...
Erratum: Experimental and Numerical Characterization of the Cyclic Thermomechanical Behavior of a High Temperature Forming Tool Alloy [ASME J. Manuf. Sci. Eng., 2010, 132, p. 051013]
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The order of authors was printed incorrectly. The correct order of authors is shown below. Aditya A. Deshpande Department of Mechanical, Materials and Manufacturing Engineering, Faculty of Engineering, University...