YaBeSH Digital Library: Recent submissions
Now showing items 13381-13400 of 316660
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Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal
(The American Society of Mechanical Engineers (ASME), 2024)Surface roughness is a critical indicator to evaluate the quality of 4H-SiC grinding surfaces. Determining surface roughness experimentally is a time-consuming and laborious process, and developing a reliable model for ... -
Non-Gaussian Multivariate Process Capability Based on the Copulas Method: An Application to Aircraft Engine Fan Blades
(The American Society of Mechanical Engineers (ASME), 2024)Process capability indices (PCIs) are major tools in geometric dimensioning and tolerancing (GD&T) for quantifying the production quality, monitoring production, or prioritizing projects. Initially, PCIs were constructed ... -
Influence of Mechanical Properties of Tube on Forming Limits and Deformation Characteristics in an Expansion Drawing Process
(The American Society of Mechanical Engineers (ASME), 2024)This paper describes an efficient method of manufacturing thin-walled metal tubes. The proposed method is an expansion drawing and it consists of two stages, flaring and drawing, during which high thickness reduction is ... -
Estimation of Injury Limits at Vulnerable Impact Locations Along the Forearm Via THUMS AM50 Finite Element Model at Airbag Loading Rates
(The American Society of Mechanical Engineers (ASME), 2024)Side and frontal airbag deployment represents the main injury mechanism to the upper extremity during automotive collisions. Previous dynamic injury limit research has been limited to testing the forearm at either the ... -
Digital Twin in Process Planning of the Additive and Subtractive Process Chain for Laser Metal Deposition and Micro Milling of Stainless Steel
(The American Society of Mechanical Engineers (ASME), 2024)Additive and subtractive (Add/Sub) manufacturing processes are increasingly being combined to produce complex parts with unique geometries and properties. However, the design of such combined processes is often challenging ... -
Warm Air Bending of AZ31B Sheets Based on an Online Local Contact Heating Method
(The American Society of Mechanical Engineers (ASME), 2024)Warm forming holds significant potential in shaping challenging materials due to its comprehensive advantages compared to cold and hot forming. Effective heating is crucial for precise warm forming processes. This study ... -
Multi-Pass Laser Polishing of As-Built Directed Energy Deposition Surfaces
(The American Society of Mechanical Engineers (ASME), 2024)Laser polishing (LP) provides a fast and efficient way of remelting part surfaces manufactured by additive manufacturing to alter both their geometric as well as physical properties. Depending on the laser parameters, ... -
Investigation of Fiber Orientation of Fused Filament Fabricated CFRP Composites via an External Magnetic Field
(The American Society of Mechanical Engineers (ASME), 2024)For carbon fiber-reinforced plastic (CFRP) composites, controlling the interior fiber distribution and orientation during the manufacturing process is a common approach to optize the structural performance of fabricated ... -
Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
(The American Society of Mechanical Engineers (ASME), 2024)This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method ... -
Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies
(The American Society of Mechanical Engineers (ASME), 2024)Wafer quality control is one of the important processes to improve the yield rate of semiconductor products. Profile quality and defects in the wafer are two key factors that should be taken into consideration. In this ... -
Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
(The American Society of Mechanical Engineers (ASME), 2024)In smart manufacturing, semiconductors play an indispensable role in collecting, processing, and analyzing data, ultimately enabling more agile and productive operations. Given the foundational importance of wafers, the ... -
Hole Edge Metrology and Inspection by Edge Diffractometry
(The American Society of Mechanical Engineers (ASME), 2024)This article introduces a novel hole edge inspection and metrology technology by edge diffractometry, which occurs when light interacts with the hole edge. The proposed method allows for simultaneous characterization of ... -
Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing
(The American Society of Mechanical Engineers (ASME), 2024)In practical semiconductor processes, the defect analysis for wafer map is a critical step for improving product quality and yield. These defect patterns can provide important process information so that the process engineers ... -
Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning
(The American Society of Mechanical Engineers (ASME), 2024)The high cost of collecting and annotating wafer bin maps (WBMs) necessitates few-shot WBM classification, i.e., classifying WBM defect patterns using a limited number of WBMs. Existing few-shot WBM classification algorithms ... -
Consequence of Red Blood Cells Deformability on Heat Sink Effect of Blood in a Three-Dimensional Bifurcated Vessel
(The American Society of Mechanical Engineers (ASME), 2024)Several diseases like Sickle Cell Anemia, Thalassemia, Hereditary Spherocytosis, Malaria, and Micro-angiopathic Hemolytic Anemia can alter the normal shape of red blood cells (RBCs). The objective of this study is to gain ... -
Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
(The American Society of Mechanical Engineers (ASME), 2024)Defective chips in wafer bin maps (WBMs) form different spatial patterns depending on the root causes of process failures. Therefore, the identification of defect patterns in WBMs can help practitioners identify the root ... -
Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer
(The American Society of Mechanical Engineers (ASME), 2024)Silicon carbide (SiC) has been widely utilized in the semiconductor industry for the development of high-power electrical devices. Using chemical vapor deposition to grow a thin epitaxial layer onto the SiC substrate surface ... -
Effects of Antifoaming Agents on Manufacturing Silver Dendrites Through Fluoride-Assisted Galvanic Replacement Reaction
(The American Society of Mechanical Engineers (ASME), 2024)In fluoride-assisted galvanic replacement reaction (FAGRR), metallic dendrites are formed simultaneously with hydrogen gas. However, the presence of hydrogen bubbles impedes the reduction of metallic ions to form metallic ... -
Nondestructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy-Current Sensor
(The American Society of Mechanical Engineers (ASME), 2024)This paper presents a novel nondestructive testing system, magneto-eddy-current sensor (MECS), to enable surface profiling of dissimilar materials by combining magnetic sensing for ferromagnetic materials and eddy-current ... -
Hybrid Analytical-Numerical Modeling of Surface Geometry Evolution and Deposition Integrity in a Multi-Track Laser-Directed Energy Deposition Process
(The American Society of Mechanical Engineers (ASME), 2024)Modeling multitrack laser-directed energy deposition (LDED) is different from single-track deposition. There is a temporal variation in the deposition geometry and integrity in a multitrack deposition, which is not well ...