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contributor authorZhang, Bin
contributor authorZhang, Hongliang
contributor authorZhao, Zi'ang
contributor authorLiu, Qiang
contributor authorZeng, Fanpeng
contributor authorCui, Yingxin
contributor authorXu, Mingsheng
contributor authorXu, Xiangang
contributor authorLinewih, Handoko
contributor authorHan, Jisheng
contributor authorZhong, Yu
date accessioned2026-08-23T08:19:11Z
date available2026-08-23T08:19:11Z
date copyright2026/09/01
date issued2026
identifier issn1043-7398
identifier otherep-24-1098.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316380
description abstractAbstract. The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current capability of single-chip packaged SiC SBD and dual-chip packaged SiC SBD. The result indicates that the dual-chip SBD with the same power has a higher nonrepetitive surge current limit. This article also focuses on the prediction of nonrepetitive surge current limits for dual-chip packaged SiC SBDs using an electrothermal model. The simulation and the actual device test results are matching well within 2.8% margin. Thus, it represents this simulation model that can be applied to predict the surge current capacity of the dual-chip packaged SiC SBD.
publisherThe American Society of Mechanical Engineers (ASME)
titleSurge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes
typeJournal Paper
journal volume148
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4070687
journal fristpage267
journal lastpage270
page4
treeJournal of Electronic Packaging:;2026:;volume( 148 ):;issue:003
contenttypeFulltext


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