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contributor authorShe, Pengcheng
contributor authorHe, Qiufu
contributor authorYang, Haoze
contributor authorGong, Jun
contributor authorYuan, Zuhao
contributor authorShi, Renping
contributor authorLi, Yong
contributor authorLi, Junhui
date accessioned2026-08-23T07:34:31Z
date available2026-08-23T07:34:31Z
date copyright2026/04/01
date issued2026
identifier issn1948-5085
identifier othertsea-25-1266.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315296
description abstractAbstract. Temperature control of samples constitutes a critical aspect in magnetron sputtering processes. Poor surface temperature uniformity can lead to film warping and delamination, ultimately reducing chip production yield. Quartz lamp infrared matrix heating is a widely used method in magnetron sputtering heating systems due to its controllability and ease of adjustment. However, the temperature uniformity across the sample surface is highly sensitive to lamp arrangement, and improper layouts can result in significant temperature gradients. To improve temperature uniformity, we developed a finite element simulation model calibrated with experimental heating data. Based on this model, eight optimized lamp arrangements were designed and simulated. The results indicate that positioning lamps closer to the center enhances the heating rate in the central region and reduces temperature disparities across the sample. An optimal lamp layout was proposed based on simulations, and experimental validation confirmed a 30.27 °C reduction in temperature variation compared to the original setup, demonstrating that surface temperature uniformity is improved by 38%
publisherThe American Society of Mechanical Engineers (ASME)
titleOptimization of Temperature Field Uniformity in the Heating System of Magnetron Sputtering Equipment
typeJournal Paper
journal volume18
journal issue4
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4070423
journal fristpage434
journal lastpage452
page19
treeJournal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:004
contenttypeFulltext


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