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contributor authorZhang, Zheng
contributor authorZhu, Huiren
contributor authorYe, Lin
contributor authorYao, Chunyi
contributor authorXu, Zhipeng
contributor authorLiu, Cun-liang
date accessioned2026-08-23T07:34:10Z
date available2026-08-23T07:34:10Z
date copyright2026/03/01
date issued2026
identifier issn1948-5085
identifier othertsea-25-1118.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315288
description abstractAbstract. In a low-speed wind tunnel facility, experimental research is conducted to investigate the heat transfer coefficient (hf) distribution on the surface of a full-film vane with shaped holes using the transient liquid crystal (LC) thermography technique. The experiment explores the variation of hf on the vane surface with several aerodynamic variables, including mass flow ratio (MFR), turbulence intensity (Tu), Reynolds (Re) number, and density ratio (DR). MFR varies from 5.5% to 12.5%, Tu varies from 2% to 15%, Re varies from 300,000 to 500,000, and DR varies from 1.0 to 1.5. Eighteen rows of film holes, some of which are shaped holes, are located on the vane surface. The experimental results indicate that the outflow of coolant significantly alters and enhances the hf distribution on the suction surface, with the highest hf observed at the exit of the pressure-side film holes, gradually decreasing along the flow direction. Increasing MFR and Tu enhances the mixing of the mainstream with the coolant, thereby enhancing hf. Moreover, the enhancing effect of Tu on hf diminishes with increasing MFR. Increasing Re significantly enhances the hf due to increased flow velocity. The impact of increased DR on hf varies across different regions of the vane.
publisherThe American Society of Mechanical Engineers (ASME)
titleAerodynamic Effects on Heat Transfer for Vane With Shaped Film Holes
typeJournal Paper
journal volume18
journal issue3
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4070523
journal fristpage707
journal lastpage714
page8
treeJournal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:003
contenttypeFulltext


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