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contributor authorKalita, Sanjib
contributor authorSen, Pulak
contributor authorSen, Dipak
contributor authorDas, Sudev
contributor authorSaha, Bidyut Baran
date accessioned2024-12-24T18:42:22Z
date available2024-12-24T18:42:22Z
date copyright5/10/2024 12:00:00 AM
date issued2024
identifier issn1948-5085
identifier othertsea_16_7_071007.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302596
description abstractOwing to their exceptionally high thermal conductivity, there is a growing demand for graphene nanoparticles in phase transition heat transfer applications. This research delves into the exploration of various critical phenomena within the realm of surface science, specifically focusing on interactions at solid-liquid and liquid-liquid interfaces. In this work, graphene nanoparticles at varying concentrations are subject to electrochemical deposition on a microporous copper substrate to form graphene coated over microporous copper (GCOMC). The study encompasses a comprehensive analysis of surface characteristics, such as porosity, roughness, and wettability. Furthermore, the study involves the calculation of two key heat transfer metrics, the critical heat flux (CHF) and the boiling heat transfer coefficient (BHTC), through the execution of pool boiling experiments. The findings of this research underscore the remarkable superiority of GCOMC surfaces over their uncoated copper counterparts in terms of boiling performance. Particularly, the GCOMC surface showcases an impressive 87.5% enhancement in CHF and a 233% increase in BHTC compared to the bare copper surface. Furthermore, this investigation delves into a detailed quantitative analysis of bubble behavior, encompassing parameters such as bubble departure diameter, bubble departure frequency, and nucleation site density, employing high-speed camera techniques to comprehensively understand the underlying processes.
publisherThe American Society of Mechanical Engineers (ASME)
titlePhase Transition Heat Transfer Enhancement of a Graphene-Coated Microporous Copper Surface Using Two-Step Electrodeposition Method
typeJournal Paper
journal volume16
journal issue7
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4065358
journal fristpage71007-1
journal lastpage71007-14
page14
treeJournal of Thermal Science and Engineering Applications:;2024:;volume( 016 ):;issue: 007
contenttypeFulltext


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