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contributor authorKorbel, J.;Ostrowski, J.;Stoller, P.;Agostini, F.;Braun, T.;Bujotzek, M.;Richter, M.
date accessioned2023-04-06T13:00:37Z
date available2023-04-06T13:00:37Z
date copyright9/22/2022 12:00:00 AM
date issued2022
identifier issn19485085
identifier othertsea_15_1_011002.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4288916
description abstractSF6 is a widely used insulating gas in the electric power industry due to its high dielectric strength. However, SF6 is classified as a greenhouse gas and has a very high global warming potential (GWP). Much research and development efforts have focused on finding alternatives to SF6 which have a lower GWP. An important requirement for an SF6 alternative is that it has similar heat transport properties to SF6, since one aspect of the design of high voltage equipment is the management of the heat dissipated from the flow of current. In the present paper, we compare the convective performances of SF6 and C5flouroketone (C5FK) and C4flouronitrile (C4FN) based gas mixtures. Mixtures of CO2, O2, and C5FK/C4FN have a GWP much smaller than that of SF6, a high dielectric strength, are not classified as toxic, and have good arc interruption properties. The numerical study is based on a semicoupled computational electromagnetics (CEM) and computational fluid dynamics (CFD) analyses. The results of the numerical study are compared with experiments. There is a good agreement between the simulation results and the experiments. C5FK and C4FN based gas mixtures have good convective performance and are wellsuited for application in circuit breakers. Thus, from the temperaturerise point of view, C5FK and C4FN based gas mixtures represent an alternative to the SF6 insulating gas traditionally used.
publisherThe American Society of Mechanical Engineers (ASME)
titleConvective Performance of C5FlouroketoneBased (C5FK) and C4FlouronitrileBased (C4FN) Gas Mixtures and SF6
typeJournal Paper
journal volume15
journal issue1
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4055330
journal fristpage11002
journal lastpage110028
page8
treeJournal of Thermal Science and Engineering Applications:;2022:;volume( 015 ):;issue: 001
contenttypeFulltext


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