| description abstract | Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock. These electronic components may get exposed to high strain rates of 1 to 100 s−1 and operating temperatures up to 200 °C in critical surroundings. Doped SAC solder alloys such as SAC-Q are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). Prior data presented to date for lead-free solders, such as SAC-Q alloy, at high aging temperature and high strain rate are for 50 °C sustained exposure. In this paper, the effect of sustained exposure to temperature of 100 °C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100 °C have been tested at a range of strain rates including 10, 35, 50, and 75 s−1 and operating temperatures ranging from 25 °C up to 200 °C. Stress–strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fitted to the Anand viscoplasticity model for SAC-Q for comparison. | |
