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contributor authorChandramohan, Aditya
contributor authorLyons, Sara K.
contributor authorWeibel, Justin A.
contributor authorGarimella, Suresh V.
date accessioned2019-02-28T11:14:10Z
date available2019-02-28T11:14:10Z
date copyright10/1/2018 12:00:00 AM
date issued2018
identifier issn1043-7398
identifier otherep_140_04_041008.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254143
description abstractAccurate temperature measurement techniques are critical for monitoring hotspots that induce thermal stresses in electronics packages. Infrared thermography is a popular nonintrusive method for emissivity mapping and measuring surface temperature distribution, but is often impeded by the low native resolution of the camera. A promising technique to mitigate these resolution limits is multiframe super-resolution, which uses multiple subpixel shifted images to generate a single high-resolution image. This study quantifies the error reduction offered by multiframe super-resolution to demonstrate the potential improvement for infrared imaging applications. The multiframe super-resolution reconstruction is implemented using an algorithm developed to interpolate the sub-pixel-shifted low-resolution images to a higher resolution grid. Experimental multiframe super-resolution temperature maps of an electronic component are measured to demonstrate the improvement in feature capture and reduction in aliasing effects. Furthermore, emissivity mapping of the component surface is conducted and demonstrates a dramatic improvement in the temperature correction by multiframe super-resolution. A sensitivity analysis is conducted to assess the effect of registration uncertainty on the multiframe super-resolution algorithm; simulated images are used to demonstrate the smoothing effect at sharp emissivity boundaries as well as improvement in the feature size capture based on the native camera resolution. These results show that, within the limitations of the technique, multiframe super-resolution can be an effective approach for improving the accuracy of emissivity-mapped temperature measurements.
publisherThe American Society of Mechanical Engineers (ASME)
titleError Reduction in Infrared Thermography by Multiframe Super-Resolution
typeJournal Paper
journal volume140
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4041360
journal fristpage41008
journal lastpage041008-8
treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004
contenttypeFulltext


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