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contributor authorKearney, Daniel
contributor authorGriffin, Justin
date accessioned2017-05-09T01:09:34Z
date available2017-05-09T01:09:34Z
date issued2014
identifier issn0022-1481
identifier otherht_136_08_081401.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/155335
description abstractIncreasing trends toward integrated power electronic systems demand advancements in novel, efficient thermal management solutions to cope with the increasing the power density. This paper investigates the performance of a novel open loop pulsating heat pipe embedded in an FR4 organic substrate. The heat pipe is comprised of 26 parallel minichannels, 13 turns with an average hydraulic diameter of 1.7 mm and maximum surface roughness of 2.5 خ¼m. The bulk thermal performance of three saturated working fluids—Novec 649, Novec 7200 and Ethanol (99.8%)—is investigated in terms of fill ratio, three angles of orientation, and applied heat fluxes ranging from 0.4 to 2.5 W/cm2 at subambient pressures. Novec 649 achieved quasistable pulsations at lower heat fluxes compared to Novec 7200 and Ethanol (99.8%). In addition, the dielectric Novec 649 fluid showed significant potential for integrated heat spreading applications demonstrating heat transfer of up to 176 W and thermal resistances as low as 0.25 آ°C/W for a filling ratio of 30%—16 times greater than that of a standard dry FR4 substrate
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
typeJournal Paper
journal volume136
journal issue8
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4027131
journal fristpage81401
journal lastpage81401
identifier eissn1528-8943
treeJournal of Heat Transfer:;2014:;volume( 136 ):;issue: 008
contenttypeFulltext


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