| contributor author | Herwig, Heinz | |
| date accessioned | 2017-05-09T01:00:07Z | |
| date available | 2017-05-09T01:00:07Z | |
| date issued | 2013 | |
| identifier issn | 0022-1481 | |
| identifier other | ht_135_11_111013.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/152265 | |
| description abstract | In a discussion initiated by the German Research Foundation (DFG) about cooling of electronics, two aspects turned out to be important: The need for a paradigm shift from an “add on†to an “integrated multidisciplinary†solution and the definition of generic demonstrators for cooling strategies. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift | |
| type | Journal Paper | |
| journal volume | 135 | |
| journal issue | 11 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.4024621 | |
| journal fristpage | 111013 | |
| journal lastpage | 111013 | |
| identifier eissn | 1528-8943 | |
| tree | Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 011 | |
| contenttype | Fulltext | |
