Show simple item record

date accessioned2017-05-09T01:00:06Z
date available2017-05-09T01:00:06Z
date issued2013
identifier issn0022-1481
identifier otherht_135_11_110501.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/152251
description abstractWe take immense pleasure in taking out a special issue on recent works on high heat flux cooling of electronics. Research on high heat flux electronic cooling has gathered momentum and has been developed as a highly specialized study in the traditional as well as new and emerging areas in the field of thermal science and engineering. Papers on cutting edge research in the field of high heat flux electronic cooling have been submitted. In all, 27 papers were submitted. All the papers had undergone the stringent review process of ASME Journal of Heat Transfer standard. Finally, out of these 27 manuscripts, only 17 papers have been accepted for publication. Accepted papers exemplify the best ideas deserving archival publication in Journal of Heat Transfer.
publisherThe American Society of Mechanical Engineers (ASME)
titleForeword
typeJournal Paper
journal volume135
journal issue11
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4024626
journal fristpage110501
journal lastpage110501
identifier eissn1528-8943
treeJournal of Heat Transfer:;2013:;volume( 135 ):;issue: 011
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record