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contributor authorReedy, Jr. ,E. D.
contributor authorCox, J. V.
date accessioned2017-05-09T00:58:44Z
date available2017-05-09T00:58:44Z
date issued2013
identifier issn0094-4289
identifier othermats_135_1_011008.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151776
description abstractFinite element analysis techniques were used to study the release step in a nanofabrication process. These calculations employed a novel adhesion/atomistic friction surface interaction model to define how the glassy polymer interacts with the hard mold. This model is applicable to solids that interact via relatively weak, van der Waals forces and is applicable to intentionally weakened interfaces (e.g., when a mold release is used). The goal of this effort is to simulate the entire separation process. The release step was studied by performing unit cell calculations for a pattern composed of identical, parallel channels. The interface between the mold and the glassy polymer did not unzip in a continuous, quasistatic manner in these simulations. Instead, there was a complex failure sequence that included multiple dynamic separations and arrest events as well as adhesive reattachment. The sensitivity of the release process to interface and bulk material properties, polymer shrinkage, and feature geometry was then quantified by examining variations from a baseline configuration. Finally, the feasibility of a hierarchical analysis that represents the nanometerscale pattern by a pattern traction–separation (T–U) relationship, which is defined by a unit cell analysis, was demonstrated.
publisherThe American Society of Mechanical Engineers (ASME)
titleHierarchical Analysis of the Release Step in a Nanofabrication Process Using an Adhesion/Atomistic Friction Surface Interaction Model
typeJournal Paper
journal volume135
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.4023042
journal fristpage11008
journal lastpage11008
identifier eissn1528-8889
treeJournal of Engineering Materials and Technology:;2013:;volume( 135 ):;issue: 001
contenttypeFulltext


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