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contributor authorArghode, Vaibhav K.
contributor authorKumar, Pramod
contributor authorJoshi, Yogendra
contributor authorWeiss, Thomas
contributor authorMeyer, Gary
date accessioned2017-05-09T00:57:41Z
date available2017-05-09T00:57:41Z
date issued2013
identifier issn1528-9044
identifier otherep_135_03_030902.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151424
description abstractEffective air flow distribution through perforated tiles is required to efficiently cool servers in a raised floor data center. We present detailed computational fluid dynamics (CFD) modeling of air flow through a perforated tile and its entrance to the adjacent server rack. The realistic geometrical details of the perforated tile, as well as of the rack are included in the model. Generally, models for air flow through perforated tiles specify a step pressure loss across the tile surface, or porous jump model based on the tile porosity. An improvement to this includes a momentum source specification above the tile to simulate the acceleration of the air flow through the pores, or body force model. In both of these models, geometrical details of tile such as pore locations and shapes are not included. More details increase the grid size as well as the computational time. However, the grid refinement can be controlled to achieve balance between the accuracy and computational time. We compared the results from CFD using geometrical resolution with the porous jump and body force model solution as well as with the measured flow field using particle image velocimetry (PIV) experiments. We observe that including tile geometrical details gives better results as compared to elimination of tile geometrical details and specifying physical models across and above the tile surface. A modification to the body force model is also suggested and improved results were achieved.
publisherThe American Society of Mechanical Engineers (ASME)
titleRack Level Modeling of Air Flow Through Perforated Tile in a Data Center
typeJournal Paper
journal volume135
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4024994
journal fristpage30902
journal lastpage30902
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003
contenttypeFulltext


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