Show simple item record

contributor authorDustin W. Demetriou
contributor authorH. Ezzat Khalifa
date accessioned2017-05-09T00:49:27Z
date available2017-05-09T00:49:27Z
date copyrightJune, 2012
date issued2012
identifier issn1528-9044
identifier otherJEPAE4-26326#020904_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148587
description abstractThe work presented in this paper describes a simplified thermodynamic model that can be used for exploring optimization possibilities in air-cooled data centers. The model is used to evaluate parametrically the total energy consumption of the data center cooling infrastructure for data centers that utilize aisle containment. The analysis highlights the importance of reducing the total power required for moving the air within the computer room air conditioners (CRACs), the plenum, and the servers, rather than focusing primarily or exclusively on reducing the refrigeration system’s power consumption. In addition, the benefits of introducing a bypass recirculation branch in enclosed aisle configurations are shown. The analysis shows a potential for as much as a 60% savings in cooling infrastructure energy consumption by utilizing an optimized enclosed aisle configuration with bypass recirculation, instead of a traditional enclosed aisle in which all the data center exhaust is forced to flow through the CRACs. Furthermore, computational fluid dynamics is used to evaluate practical arrangements for implementing bypass recirculation in raised floor data centers. A configuration where bypass tiles, with controllable low-lift fans, are placed close to the discharge of CRACs results in increased mixing and is shown to be a suitable method for providing nearly thermally uniform conditions to the inlet of the servers in an enclosed cold aisle. Other configurations of bypass implementation are also discussed and explored.
publisherThe American Society of Mechanical Engineers (ASME)
titleOptimization of Enclosed Aisle Data Centers Using Bypass Recirculation
typeJournal Paper
journal volume134
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4005907
journal fristpage20904
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsTemperature
keywordsCooling
keywordsComputational fluid dynamics
keywordsOptimization
keywordsData centers
keywordsEnergy consumption
keywordsTiles
keywordsRefrigeration
keywordsFans AND Bifurcation
treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record