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contributor authorWenqian Hu
contributor authorYung C. Shin
contributor authorGalen B. King
date accessioned2017-05-09T00:39:25Z
date available2017-05-09T00:39:25Z
date copyrightFebruary, 2010
date issued2010
identifier issn1087-1357
identifier otherJMSEFK-28313#011009_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/144091
description abstractMicrohole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys, and ceramics are reported. Blind and through microholes are drilled by percussion drilling as well as trepanning drilling, where the diameters of the holes are in the range of 20–1000 μm. Microfeatures are also machined and the flexibility of ps laser machining is demonstrated. The quality of drilled holes, e.g., recast layer, microcrack, and conicity, and that of the microstructures, are investigated by an optical microscope, a surface profilometer, or a scanning electron microscope. Ps laser ablation rate is studied by experiments and a simplified laser ablation model.
publisherThe American Society of Mechanical Engineers (ASME)
titleMicromachining of Metals, Alloys, and Ceramics by Picosecond Laser Ablation
typeJournal Paper
journal volume132
journal issue1
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4000836
journal fristpage11009
identifier eissn1528-8935
keywordsMetals
keywordsLasers
keywordsMachining
keywordsDrilling
keywordsLaser ablation
keywordsMicromachining
keywordsAblation (Vaporization technology)
keywordsAlloys AND Ceramics
treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 001
contenttypeFulltext


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