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contributor authorWande Zhang
contributor authorLi-Hsin Han
contributor authorShaochen Chen
date accessioned2017-05-09T00:39:20Z
date available2017-05-09T00:39:20Z
date copyrightJune, 2010
date issued2010
identifier issn1087-1357
identifier otherJMSEFK-28371#030907_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/144047
description abstractIn this work, we demonstrate the plausibility of integrating two-photon polymerization (TPP) with nanoimprinting for direct, digital nanomanufacturing. TPP offers manufacturing of nanomolds at a low cost, while the nanoimprinting process using the nanomolds enables massively parallel printing of nanostructures. A Ti:sapphire femtosecond laser (800 nm wavelength, 100 fs pulse width, at a repetition rate of 80 MHz) was used to induce TPP in dipentaerythritol pentaacrylate to fabricate the nanoimprinting mold with 400 nm wide line array on a glass substrate. The mold surface was silanized by tridecafuoro-1,1,2,2-tetrahydrooctyl-1 trichlorosilane to facilitate the detachment of the mold from the imprinted material. This mold was then used to imprint poly(ethylene glycol) diacrylate (PEGDA). PEGDA is an important biomaterial for many applications such as tissue scaffolds for cell growth. A spectrophotometer and a scanning electron microscope were used to characterize the materials and nanostructures.
publisherThe American Society of Mechanical Engineers (ASME)
titleIntegrated Two-Photon Polymerization With Nanoimprinting for Direct Digital Nanomanufacturing
typeJournal Paper
journal volume132
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4001661
journal fristpage30907
identifier eissn1528-8935
keywordsPhotons
keywordsLasers
keywordsGlass
keywordsManufacturing
keywordsPolymerization
keywordsPolymers
keywordsNanostructures
keywordsWavelength
keywordsSilicon
keywordsPhotopolymers
keywordsReflectometers
keywordsScanning electron microscopes
keywordsMaterials preparation AND Sapphire
treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 003
contenttypeFulltext


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