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contributor authorAnna Brusilovski
date accessioned2017-05-09T00:39:14Z
date available2017-05-09T00:39:14Z
date copyrightDecember, 2010
date issued2010
identifier issn1087-1357
identifier otherJMSEFK-28418#064505_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143993
description abstractPulse microelectrochemical machining (ECM) by bipolar current is a method allowing the manufacturing of microholes and micropatterns. In many cases, microholes with parallel walls and accurate micropatterns can only be manufactured with the application of an electrically isolating coating to the side surfaces of the cathode. The goal of this research was to find a durable coating for this process. Epoxy resins, Teflon, and diamond-like carbon are considered as dielectric cathode coatings. Different aspects of the working environment of these coatings in the pulse bipolar ECM process, such as electric field, chemical composition, and physical influences of the electrolyte, are analyzed. The main reasons for the low process durability of coatings are poor adhesion and harsh chemical and physical environments. The most promising coating for the process is diamond-like carbon, which shows significantly better performance than the other coatings. Improved adhesion of a coating to the cathode can dramatically improve its durability in the pulse bipolar ECM environment and therefore permits an efficient manufacturing process.
publisherThe American Society of Mechanical Engineers (ASME)
titleDielectric Coating of Cathodes for Microfabrication Using Electrochemical Method
typeJournal Paper
journal volume132
journal issue6
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4003123
journal fristpage64505
identifier eissn1528-8935
keywordsCoating processes
keywordsCoatings
keywordsDurability
keywordsElectrolytes
keywordsElectric fields
keywordsMachining
keywordsEpoxy resins AND Microfabrication
treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006
contenttypeFulltext


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