Enhancement of Saturation Boiling of PF-5060 on Microporous Copper Dendrite Surfaces

Abstract

Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10×10 mm2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses (145.6 μm, 46.3 μm, and 33.1 μm). The thickest layer gives the best results: the saturation CHF of 25.27 W/cm2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, hMNB, near the end of the fully developed nucleate boiling region, is 8.76 W/cm2 K. In addition, nucleate boiling ensues at a surface temperature slightly above saturation (<0.5 K), with no temperature excursion. The temperature excursions before initiating boiling on the 46.3 μm and 33.1 μm thick Cu nanodendrite surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of ∼55.1°C and 57.4°C, respectively. These temperatures are much lower than recommended (85°C) for reliable operation of most silicon electronics and central processor units.