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contributor authorJoy J. Cheng
contributor authorJosé A. Alvarado-Contreras
contributor authorMaria A. Polak
contributor authorAlexander Penlidis
date accessioned2017-05-09T00:38:03Z
date available2017-05-09T00:38:03Z
date copyrightJanuary, 2010
date issued2010
identifier issn0094-4289
identifier otherJEMTA8-27124#011016_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143381
description abstractIt has long been suspected that physical chain entanglements in the amorphous phase affect the strain hardening behavior of polyethylene. The precise number of chain entanglements in solid polyethylene cannot be measured using any current techniques. Since entanglements in the melt state are known to be preserved in the polymer upon solidification, determination of the molecular weight between entanglements (Me) is used as a measure of chain entanglements for polyethylene. A decrease in molecular weight between entanglements means an increase in the number of entanglements in the polymer. As the Me value decreases, increasing tensile strain hardening of polyethylene is observed. In addition to experimental work, parallel micromechanical modeling was carried out to study the entanglement effect in uniaxial tensile deformation. The model was able to shed more light over the earlier empirical speculations. By combining experimental observations and modeling results, the presence of physical chain entanglements in the amorphous phase was demonstrated to be the controlling factor in strain hardening behavior of polyethylene.
publisherThe American Society of Mechanical Engineers (ASME)
titleChain Entanglements and Mechanical Behavior of High Density Polyethylene
typeJournal Paper
journal volume132
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.4000220
journal fristpage11016
identifier eissn1528-8889
keywordsDeformation
keywordsChain
keywordsPolymers
keywordsResins
keywordsWork hardening
keywordsModeling
keywordsStress AND Density
treeJournal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 001
contenttypeFulltext


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