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contributor authorRui Yao
contributor authorJames Blanchard
date accessioned2017-05-09T00:33:51Z
date available2017-05-09T00:33:51Z
date copyrightMay, 2009
date issued2009
identifier issn0022-1481
identifier otherJHTRAO-27860#052401_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/141073
description abstractSmall scale, thermally driven power sources will require appropriate insulation to achieve sufficiently high thermal conversion efficiencies. This paper presents a micro-insulation design, which was developed for a thermionic microbattery, which converts the decay heat from radioactive isotopes directly to electricity using a vacuum thermionic diode. The insulation concept, which is suitable for any small scale application, separates two planar surfaces with thin, semicircular posts, thus reducing conduction heat transfer and increasing the relative radiation heat transfer. In this case, the surfaces are silicon wafers and the columns are SU-8, a photoresist material. The experimental results indicate that this design is adequate for a practical power source concept, and they are supported by a numerical model for the effective thermal conductivity of the structure. The results show that a typical design of 20 columns/cm2 with a 200 μm diameter and a 10 μm wall thickness has an apparent thermal conductivity on the order of 10−4 W/m K at a pressure of 1 Pa. System models of a thermionic power source indicate that this is sufficiently low to provide practical efficiency.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Micro-Insulation Concept for MEMS Applications
typeJournal Paper
journal volume131
journal issue5
journal titleJournal of Heat Transfer
identifier doi10.1115/1.3084121
journal fristpage52401
identifier eissn1528-8943
keywordsHeat conduction
keywordsThermal conductivity
keywordsInsulation
keywordsHeat
keywordsTemperature
keywordsPressure
keywordsRadiation (Physics)
keywordsMicroelectromechanical systems AND Heat transfer
treeJournal of Heat Transfer:;2009:;volume( 131 ):;issue: 005
contenttypeFulltext


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