| contributor author | G. De Mey | |
| contributor author | M. Wójcik | |
| contributor author | J. Banaszczyk | |
| contributor author | A. Napieralski | |
| contributor author | M. De Paepe | |
| contributor author | B. Vermeersch | |
| contributor author | J. Pilarski | |
| contributor author | M. Lasota | |
| date accessioned | 2017-05-09T00:32:23Z | |
| date available | 2017-05-09T00:32:23Z | |
| date copyright | March, 2009 | |
| date issued | 2009 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26292#014501_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/140335 | |
| description abstract | The thermal impedance Zth(jω) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Zth(jω) the influence of the chimney on the reduction in thermal resistance Rth=Zth(jω=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency ω provides specific information about the thermal path being influenced by the chimney. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin | |
| type | Journal Paper | |
| journal volume | 131 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3068307 | |
| journal fristpage | 14501 | |
| identifier eissn | 1043-7398 | |
| keywords | Cooling | |
| keywords | Impedance (Electricity) | |
| keywords | Natural convection | |
| keywords | Transistors | |
| keywords | Thermal resistance AND Junctions | |
| tree | Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001 | |
| contenttype | Fulltext | |
