Computation of Thermal Stress Intensity Factors for Bimaterial Interface Cracks Using Domain Integral Method

Abstract

The concept of domain integral used extensively for J integral has been applied in this work for the formulation of J2 integral for linear elastic bimaterial body containing a crack at the interface and subjected to thermal loading. It is shown that, in the presence of thermal stresses, the Jk domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain integral with the Jk integral. The proposed method is validated by solving standard problems with known solutions.