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contributor authorYoungjae Kim
contributor authorSudhanva Gurumurthi
contributor authorAnand Sivasubramaniam
contributor authorJeonghwan Choi
date accessioned2017-05-09T00:27:32Z
date available2017-05-09T00:27:32Z
date copyrightDecember, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26289#041105_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137744
description abstractThermal-aware design of disk-drives is important because high temperatures can cause reliability problems. Dynamic thermal management (DTM) techniques have been proposed to operate the disk at the average case temperature, rather than at the worst case by modulating the activities to avoid thermal emergencies caused by unexpected events, such as fan-breaks, increased inlet air temperature, etc. A delay-based approach to adjust the disk seek activities is one such DTM solution for disk-drives. Even if such a DTM approach could overcome thermal emergencies without stopping disk activity, it suffers from long delays when servicing the requests. In this paper, we investigate the possibility of using a multispeed disk-drive (called dynamic rotations per minute (DRPM)), which dynamically modulates the rotational speed of the platter for implementing the DTM technique. Using a detailed performance and thermal simulator of a storage system, we evaluate two possible DTM policies—time-based and watermark-based—with a DRPM disk-drive and observe that dynamic RPM modulation is effective in avoiding thermal emergencies. However, we find that the time taken to transition between different rotational speeds of the disk is critical for the effectiveness of this DTM technique.
publisherThe American Society of Mechanical Engineers (ASME)
titleManaging Thermal Emergencies in Disk-Based Storage Systems
typeJournal Paper
journal volume130
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2993152
journal fristpage41105
identifier eissn1043-7398
keywordsDisks
keywordsEmergencies AND Temperature
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
contenttypeFulltext


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