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contributor authorBharat Bhushan
contributor authorShaobiao Cai
date accessioned2017-05-09T00:26:28Z
date available2017-05-09T00:26:28Z
date copyrightSeptember, 2008
date issued2008
identifier issn0003-6900
identifier otherAMREAD-25896#050803_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137180
description abstractAdhesion, friction/stiction, and wear are among the main issues in various commercial applications, including magnetic storage devices, microelectromechanical systems, and nanoelectromechanical systems, having contact interfaces with normal or tangential motion. The contact analysis of multilayered structures under both dry and wet conditions with and without relative motion, which simulates the actual contact situations of the devices, is needed to obtain optimum design parameters, including materials with desired mechanical properties and layer thicknesses. The contact analyses have been used to predict the contact pressure profile on the interface and contact statistics, namely, fractional contact area, the [value of contact pressure, von Mises, principal tensile and shear stresses, and relative meniscus force. The early work does not consider surface roughness and this has been carried out in the later studies for single and multilayered solid surfaces. A numerical three-dimensional multilayered rough contact model is presented in detail to investigate the effects of roughness, stiffness, hardness, layer thicknesses, load, coefficient of friction, and meniscus contribution. Applications of the model to magnetic storage devices are presented.
publisherThe American Society of Mechanical Engineers (ASME)
titleDry and Wet Contact Modeling of Multilayered Rough Solid Surfaces
typeJournal Paper
journal volume61
journal issue5
journal titleApplied Mechanics Reviews
identifier doi10.1115/1.2972161
journal fristpage50803
identifier eissn0003-6900
keywordsPressure
keywordsSurface roughness
keywordsStress
keywordsFriction
keywordsForce
keywordsThickness AND Displacement
treeApplied Mechanics Reviews:;2008:;volume( 061 ):;issue: 005
contenttypeFulltext


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