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contributor authorN. Kalyanasundaram
contributor authorJ. B. Freund
contributor authorH. T. Johnson
date accessioned2017-05-09T00:16:16Z
date available2017-05-09T00:16:16Z
date copyrightOctober, 2005
date issued2005
identifier issn0094-4289
identifier otherJEMTA8-27074#457_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131862
description abstractHighly disordered, ion-processed silicon is studied using a molecular dynamics simulation with empirical interatomic potentials. The surface free energy density, stress-strain relations, and continuum surface features of silicon, bombarded in the simulations to relatively high fluence by medium energy argon ions, are computed statistically by preparing multiple randomized ion-bombarded specimens. The surface-free energy per unit area for the ion-bombarded silicon is about 1.76J∕m2, much lower than the 2.35J∕m2 corresponding to a (001) unrelaxed, crystalline silicon surface. A stress-strain curve is obtained computationally by performing a constant strain test on the ion-bombarded specimens and by calculating stresses from the interatomic forces acting across different cross sections in the sample. The resulting tensile elastic modulus of the material, while slightly elevated due to the prominence of the free surface in the thin layer, is in good agreement with available experimental data. The surface is characterized using an interatomic potential-based C2 continuous sampling method.
publisherThe American Society of Mechanical Engineers (ASME)
titleAtomistic Determination of Continuum Mechanical Properties of Ion-Bombarded Silicon
typeJournal Paper
journal volume127
journal issue4
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2020014
journal fristpage457
journal lastpage461
identifier eissn1528-8889
keywordsStress
keywordsStress-strain relations
keywordsSilicon
keywordsSurface energy
keywordsMechanical properties
keywordsAtoms
keywordsFluence (Radiation measurement)
keywordsIons
keywordsDensity AND Force
treeJournal of Engineering Materials and Technology:;2005:;volume( 127 ):;issue: 004
contenttypeFulltext


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