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contributor authorM. Dube
contributor authorT. Kundu
date accessioned2017-05-09T00:15:53Z
date available2017-05-09T00:15:53Z
date copyrightJune, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26243#147_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131654
description abstractField reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (, 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic Pb∕Sn data of (, , and , 2001, “Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging,” report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleYield Function for Solder Elastoviscoplastic Modeling
typeJournal Paper
journal volume127
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1869514
journal fristpage147
journal lastpage156
identifier eissn1043-7398
keywordsTemperature
keywordsSolders
keywordsModeling AND Stress
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002
contenttypeFulltext


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