| contributor author | Thomas D. Moore | |
| contributor author | John L. Jarvis | |
| date accessioned | 2017-05-09T00:12:46Z | |
| date available | 2017-05-09T00:12:46Z | |
| date copyright | March, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26228#106_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129897 | |
| description abstract | The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1649240 | |
| journal fristpage | 106 | |
| journal lastpage | 109 | |
| identifier eissn | 1043-7398 | |
| keywords | Electrical resistance | |
| keywords | Stress | |
| keywords | Delamination | |
| keywords | Temperature AND Design | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
| contenttype | Fulltext | |