| contributor author | W. Salalha | |
| contributor author | P. Z. Bar-Yoseph | |
| contributor author | E. Zussman | |
| date accessioned | 2017-05-09T00:12:45Z | |
| date available | 2017-05-09T00:12:45Z | |
| date copyright | March, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26228#48_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129886 | |
| description abstract | An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small (Bo≪1, where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Investigation of Flip-Chip Bonding for MEMS Applications | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1646427 | |
| journal fristpage | 48 | |
| journal lastpage | 51 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Bonding | |
| keywords | Microelectromechanical systems | |
| keywords | Finite element analysis | |
| keywords | Solder joints AND Flip-chip | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
| contenttype | Fulltext | |
