| contributor author | Qiang Xiao | |
| contributor author | Harold J. Bailey | |
| contributor author | William D. Armstrong | |
| date accessioned | 2017-05-09T00:12:43Z | |
| date available | 2017-05-09T00:12:43Z | |
| date copyright | June, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26233#208_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129868 | |
| description abstract | Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy continually age-softened, this softening correlated with the growth of relatively large tin-rich crystals. The 180°C aged Sn3.9Ag0.6Cu alloy initially age-softened, and the minimum flow strength was reached after one day at 180°C. This softening correlated with the growth of relatively large tin-rich crystals and with the coarsening of Ag3Sn particles. When aged at 180°C beyond one day the Sn3.9Ag0.6Cu alloy age-hardened, the hardening correlated with the dispersion of Ag3Sn particles into tin-rich crystals which previously had not contained intermetallic precipitates. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1756144 | |
| journal fristpage | 208 | |
| journal lastpage | 212 | |
| identifier eissn | 1043-7398 | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Temperature | |
| keywords | Intermetallic compounds | |
| keywords | Flow (Dynamics) AND Lead-free solders | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002 | |
| contenttype | Fulltext | |
