| contributor author | Takehiro Saitoh | |
| contributor author | Hidehito Matsuyama | |
| contributor author | Masayuki Toya | |
| date accessioned | 2017-05-09T00:09:53Z | |
| date available | 2017-05-09T00:09:53Z | |
| date copyright | September, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26221#420_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128204 | |
| description abstract | Using Kr85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in large-scale integrated circuit (LSI) plastic packages with either Cu alloy or alloy 42 leadframes are experimentally identified. Based on the experimental results, the processes of delamination growth and subsequent resin cracking are clarified. The effect of the length of the delaminations on the resin cracking is numerically analyzed on the basis of the linear fracture mechanics approach combined with finite element calculations. The directions of resin cracking predicted from the analysis are found to agree well with those of actual packages. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1602706 | |
| journal fristpage | 420 | |
| journal lastpage | 425 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Fracture (Process) | |
| keywords | Resins | |
| keywords | Delamination | |
| keywords | Copper alloys | |
| keywords | Alloys | |
| keywords | Wedges AND Fracture mechanics | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003 | |
| contenttype | Fulltext | |
