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contributor authorRavi S. Prasher
contributor authorPaul Koning
contributor authorJames Shipley
contributor authorAmit Devpura
date accessioned2017-05-09T00:09:52Z
date available2017-05-09T00:09:52Z
date copyrightSeptember, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26221#386_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128199
description abstractThis paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further compared with the percolation model and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different filler or particle loading. A novel mechanical length scale is defined to understand the mechanical response of these materials, and is correlated to the viscosity of these materials.
publisherThe American Society of Mechanical Engineers (ASME)
titleDependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
typeJournal Paper
journal volume125
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1602703
journal fristpage386
journal lastpage391
identifier eissn1043-7398
keywordsParticulate matter
keywordsThermal conductivity
keywordsContact resistance
keywordsStiffness
keywordsModeling
keywordsPolymers AND Fillers (Materials)
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
contenttypeFulltext


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