| contributor author | Sung Yi | |
| contributor author | Guangxing Luo | |
| contributor author | Kerm Sin Chian | |
| date accessioned | 2017-05-09T00:07:12Z | |
| date available | 2017-05-09T00:07:12Z | |
| date copyright | June, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26203#91_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126622 | |
| description abstract | In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of the main reasons for failure of solder joints. The present model has been developed based on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile, creep, and creep recover tests were conducted at temperature range from −10 to 100°C. The specimens with two different phase sizes were tested. Good agreements were obtained between the experimental results and the model. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1451845 | |
| journal fristpage | 91 | |
| journal lastpage | 96 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Solders | |
| keywords | Grain boundaries | |
| keywords | Constitutive equations | |
| keywords | Stress tensors | |
| keywords | Dislocations AND Grain size | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002 | |
| contenttype | Fulltext | |
