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contributor authorD. Ingman
contributor authorY. Michlin
date accessioned2017-05-09T00:07:10Z
date available2017-05-09T00:07:10Z
date copyrightSeptember, 2002
date issued2002
identifier issn1528-9044
identifier otherJEPAE4-26206#260_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126592
description abstractA nonlinear viscoelastic damage accumulation model with a physical approach is presented with a view to describing stress relaxation in amorphous and partially crystalline polymers. The deformation is represented as stress-aided transition through a series of symmetrical energy barriers. There is also a stress threshold, introduced by the authors and representing an asymptotic residual stress below which relaxation does not occur. The model comprises three parameters: an activation volume, V; a product of several parameters with physical meaning, A (only the combination of A and V in the form of the relaxation time constant can be reconstructed from the present set of experiments); and the relaxation threshold. It allows a practically unlimited number of energy barriers. The damage depends on the stress history. Experimental data were collected on stress relaxation of three polymers at different temperatures. The experiments involved bending of a polymer strip within a metal cylinder and measurement of the radius of curvature after removal of the strip from the cylinder, using a specially-developed method. The measured radii ranged from infinity to 1.5 cm, and the obtained data were fitted to the model. The results show that the residual stress and other model parameters are temperature-dependent.
publisherThe American Society of Mechanical Engineers (ASME)
titleDamage Accumulation During Stress Relaxation of Polymer Films in Bending
typeJournal Paper
journal volume124
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1463731
journal fristpage260
journal lastpage265
identifier eissn1043-7398
keywordsDeformation
keywordsRelaxation (Physics)
keywordsStress AND Strips
treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003
contenttypeFulltext


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