| contributor author | R. W. Neu | |
| contributor author | D. T. Scott | |
| contributor author | M. W. Woodmansee | |
| date accessioned | 2017-05-09T00:04:35Z | |
| date available | 2017-05-09T00:04:35Z | |
| date copyright | September, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26195#238_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125035 | |
| description abstract | The time- and temperature-dependent deformation behavior of two Sn-Ag base alloys, 96Sn-4Ag and Castin (96.2Sn-2.5Ag-0.8Cu-0.5Sb), used as solder interconnect materials was determined over strain rates ranging from 10−6 s−1 to 10−2 s−1 and temperatures ranging from −55°C–125°C. Uniaxial strain rate jump tests along with isothermal and thermomechanical cyclic tests were conducted. The constitutive behavior of each alloy was modeled with both a simple power law creep equation and the McDowell unified creep-plasticity model. Accumulated deformation under unconstrained thermal cycling was also measured to determine the relative dimensional stability due to internal constraints in the alloy itself. Overall, the Castin alloy appeared to be more stable and was more resistant to inelastic deformation. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1371232 | |
| journal fristpage | 238 | |
| journal lastpage | 246 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Alloys | |
| keywords | Solders AND Stress | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
| contenttype | Fulltext | |
