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contributor authorT. C. Tszeng
date accessioned2017-05-09T00:02:35Z
date available2017-05-09T00:02:35Z
date copyrightJanuary, 2000
date issued2000
identifier issn0094-4289
identifier otherJEMTA8-27003#86_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123799
description abstractThis paper presents the theoretical predictions of the stress state at the inclusion-matrix interface in discontinuous metal matrix composites by the generalized inclusion method. In the author’s previous works, this method had been extended to the elastoplastic deformation in the matrix material. The present analysis of the ellipsoidal inclusion problem indicates that the regions at the pole and the equator of the particle/matrix interface essentially remain elastic regardless of the level of deformation, although the size of the elastic region keeps decreasing as deformation becomes larger. It was also found that, when the composite is undergoing a relatively large plastic deformation (strain), the maximum interfacial normal stress is approximately linearly dependent upon the von Mises stress and the hydrostatic stress. Based on the stress criterion for void nucleation, the author determined the void nucleation loci and nucleation strain for a composite subjected to an axisymmetric macroscopic stress state. The influence of interfacial bonding strength, inclusion shape, and volume fraction on the occurrence of void nucleation have been determined. The interfacial bonding strength in a SiC-aluminum system was re-evaluated by using existing experimental evidence. [S0094-4289(00)01301-3]
publisherThe American Society of Mechanical Engineers (ASME)
titleInterfacial Stresses and Void Nucleation in Discontinuously Reinforced Composites
typeJournal Paper
journal volume122
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.482770
journal fristpage86
journal lastpage92
identifier eissn1528-8889
keywordsComposite materials
keywordsParticulate matter
keywordsStress
keywordsNucleation (Physics)
keywordsBonding AND Deformation
treeJournal of Engineering Materials and Technology:;2000:;volume( 122 ):;issue: 001
contenttypeFulltext


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