| contributor author | Anand M. Deshpande | |
| contributor author | Dan Rose | |
| contributor author | Ganesh Subbarayan | |
| date accessioned | 2017-05-09T00:02:13Z | |
| date available | 2017-05-09T00:02:13Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#6_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123570 | |
| description abstract | In this paper, a methodology, and a program based on the methodology, are presented, which, using the reliability of solder joints for various values of design/process parameters, can be estimated in seconds on a personal computer. The proposed methodology accurately captures the behavior of a solder joint in an artificial neural network (ANN) model trained to relate design as well as analysis parameters to fatigue life. The proposed methodology is novel since such simultaneous analysis and design (SAND) procedures do not appear to have been employed until now for reliability estimation of solder joints. The use of Moiré interferometry as an experimental technique to estimate the analysis-related inputs to the neutral network model is also presented in the paper. [S1043-7398(00)01101-4] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A System for First Order Reliability Estimation of Solder Joints in Area Array Packages | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483125 | |
| journal fristpage | 6 | |
| journal lastpage | 12 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Design | |
| keywords | Fatigue life | |
| keywords | Solder joints | |
| keywords | Solders | |
| keywords | Neural network models AND Artificial neural networks | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext | |
