| contributor author | H. Chai | |
| contributor author | Y. Zohar | |
| date accessioned | 2017-05-08T23:59:21Z | |
| date available | 2017-05-08T23:59:21Z | |
| date copyright | September, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26174#137_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121992 | |
| description abstract | Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792675 | |
| journal fristpage | 137 | |
| journal lastpage | 142 | |
| identifier eissn | 1043-7398 | |
| keywords | Wire | |
| keywords | Steady state | |
| keywords | Transfer molding | |
| keywords | Transparency | |
| keywords | Vents | |
| keywords | Vehicles | |
| keywords | Cavities | |
| keywords | Failure | |
| keywords | Density AND Fluid dynamics | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003 | |
| contenttype | Fulltext | |
