| contributor author | A. Gilat | |
| contributor author | K. Krishna | |
| date accessioned | 2017-05-08T23:53:12Z | |
| date available | 2017-05-08T23:53:12Z | |
| date copyright | June, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26160#81_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118535 | |
| description abstract | A new configuration for testing thin layers of solder is introduced and employed to study the effects of strain rate and thickness on the mechanical response of eutectic Sn-Pb solder. The solder in the test is loaded under a well defined state of pure shear stress. The stress and deformation in the solder are measured very accurately to produce a reliable stress-strain curve. The results show that both the stress needed for plastic deformation and ductility increase with increasing strain rate. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792223 | |
| journal fristpage | 81 | |
| journal lastpage | 84 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Shear (Mechanics) AND Thickness | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002 | |
| contenttype | Fulltext | |
