| contributor author | J. H. Lau | |
| contributor author | K.-L. Chen | |
| date accessioned | 2017-05-08T23:53:12Z | |
| date available | 2017-05-08T23:53:12Z | |
| date copyright | September, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26161#208_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118531 | |
| description abstract | The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792236 | |
| journal fristpage | 208 | |
| journal lastpage | 212 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Copper | |
| keywords | Glass | |
| keywords | Epoxy adhesives | |
| keywords | Warping | |
| keywords | Circuits | |
| keywords | Deflection | |
| keywords | Temperature distribution | |
| keywords | Thermal resistance AND Thickness | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003 | |
| contenttype | Fulltext | |
