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contributor authorC. Guo
contributor authorS. Malkin
date accessioned2017-05-08T23:50:57Z
date available2017-05-08T23:50:57Z
date copyrightFebruary, 1996
date issued1996
identifier issn1087-1357
identifier otherJMSEFK-27784#137_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/117350
description abstractThermal analyses of the grinding process generally require assumptions concerning the distributions of the heat flux to the workpiece within the grinding zone and convective cooling outside the grinding zone. The present work is concerned with the use of inverse heat transfer methods to estimate the heat flux and convection heat transfer coefficient distributions on the workpiece surface during straight surface grinding from temperature measurements within the workpiece. In the present paper, three inverse heat transfer methods are developed: temperature matching, integral, and sequential methods. Each method is evaluated for accuracy and stability using simulated temperature data. The selection of the sampling frequency of the temperature measurements and location of the temperature sensor are found to be critical for both estimation accuracy and stability. In a second paper, these inverse heat transfer methods are applied to estimate the distributions of the heat flux and convection heat transfer coefficients on the workpiece surface for grinding of steels with aluminum oxide and CBN abrasive wheels.
publisherThe American Society of Mechanical Engineers (ASME)
titleInverse Heat Transfer Analysis of Grinding, Part 1: Methods
typeJournal Paper
journal volume118
journal issue1
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.2803634
journal fristpage137
journal lastpage142
identifier eissn1528-8935
keywordsHeat transfer
keywordsGrinding
keywordsHeat flux
keywordsTemperature measurement
keywordsConvection
keywordsStability
keywordsTemperature
keywordsGrinding wheels
keywordsSampling (Acoustical engineering)
keywordsCooling
keywordsAluminum
keywordsSteel
keywordsTemperature sensors AND Thermal analysis
treeJournal of Manufacturing Science and Engineering:;1996:;volume( 118 ):;issue: 001
contenttypeFulltext


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