| contributor author | Zhenfeng Guo | |
| contributor author | Hans Conrad | |
| date accessioned | 2017-05-08T23:49:50Z | |
| date available | 2017-05-08T23:49:50Z | |
| date copyright | June, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26154#49_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116786 | |
| description abstract | An increased cooling rate following reflow produced a decrease in the microstructure size including the size of the colonies, the Pb-rich dendrites and the eutectic phases. The decrease in microstructure size gave an increased creep rate at room temperature and a decrease in the creep stress exponent. Also, thermo-mechanical fatigue crack growth rate decreased and fatigue life increased with the decrease in microstructure size. These effects of the increased cooling rate were attributed to an increase in boundary sliding which could occur from the increase in boundary area with decrease in microstructure size. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792131 | |
| journal fristpage | 49 | |
| journal lastpage | 54 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Creep | |
| keywords | Fatigue | |
| keywords | Temperature | |
| keywords | Cooling | |
| keywords | Stress | |
| keywords | Fatigue cracks | |
| keywords | Fatigue life AND Solder joints | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 002 | |
| contenttype | Fulltext | |
