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contributor authorShuichi Watanabe
contributor authorShojiro Miyake
contributor authorMasao Murakawa
date accessioned2017-05-08T23:48:17Z
date available2017-05-08T23:48:17Z
date copyrightOctober, 1995
date issued1995
identifier issn0742-4787
identifier otherJOTRE9-28516#629_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115967
description abstractCubic boron nitride (c-BN) film was deposited onto a silicon substrate by means of a magnetically enhanced plasma ion plating method utilizing a hot cathode plasma discharge in parallel magnetic field. In this study, the friction and wear behaviors of the c-BN film, particularly when it came into sliding contact with diamond, were investigated using a reciprocating tribometer in an applied normal load range of 0.1 ~ 4.9 N. The results showed that the friction coefficient of the c-BN film sliding against the diamond indenter tended to decrease as the load increased, and was very low, exhibiting values of 0.03 ~ 0.065 at the maximum load of 4.9 N. Furthermore, the study confirmed that the friction coefficient of annealed c-BN film was lower than that of as-deposited c-BN film throughout the whole load range. Judging from the results of comparable investigations in which c-BN film came into contact with other materials such as c-BN compact, SiC and stainless steel, the wear performance and peeling resistance of the c-BN film proved to be significantly better in the case of contact with diamond.
publisherThe American Society of Mechanical Engineers (ASME)
titleTribological Behavior of Cubic Boron Nitride Film Sliding Against Diamond
typeJournal Paper
journal volume117
journal issue4
journal titleJournal of Tribology
identifier doi10.1115/1.2831527
journal fristpage629
journal lastpage633
identifier eissn1528-8897
keywordsTribology
keywordsDiamonds
keywordsStress
keywordsFriction
keywordsWear
keywordsPlasmas (Ionized gases)
keywordsSilicon
keywordsStainless steel
keywordsMagnetic fields
keywordsElectrical resistance AND Plating
treeJournal of Tribology:;1995:;volume( 117 ):;issue: 004
contenttypeFulltext


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